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HDI PCB (High Density Interconnect Printed Circuit Board)

What are HDI PCBs?

HDI PCBs has higher circuitry density than conventional PCBs, with finer lines and spaces, smaller vias and capture pads, and higher connection pad density. HDI PCBs contain blind/buried vias and often microvias 4mil-6mil. Laser drill would be required for microvias of 4mil.


HDI PCBs are used to reduce the size and weight to make products light and thin, as well as to enhance electrical performance of the device, such as mobile phones, touch screen and 4G network communications.

Advanced Capabilities

Layer 4-24
Max. Number of Interconnected layer 4
Material FR4 standard Tg 140C,FR4 High Tg 170C, FR4 and Rogers combined lamination
Thickness (Finished Board) 0.4mm-3.0MM
Max. Board Size 457mm*610mm
Copper Weight 0.5oz-2.0 oz
Surface Finish HASL -Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG -Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
Soldermask Color Green, red, black, yellow, white, blue, green matt, black matt
Silkscreen Legend Color White, Black, Yellow
HDI Structures Check the following chart
Max. Exponents of Blind/Buried Vias stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Min. Tracing/Spacing 2.5mil/2.5 mil
Min. Diameter of Drill 6mil
Min. Diameter of Laser Drill 4mil
Min. Annular Ring of Drill 4mil
Min. Annular Ring of Laser Drill 3mil
Flex-Rigid combination Yes
Via In Pad Yes
Buried Capacitor prototype only(The total area should be smaller than 1 Square meter)

HDI Structures

HDI Structures Type of micorovias Mass production Middle/small batch Prototype Apply To
1+N+1 Blind vias Yes Yes Yes 4 layer+
2+N+2 Blind/Buried staggered vias Yes Yes Yes 6 layer+
2+N+2 Blind/Buried stacked vias Yes Yes Yes 6 layer+
3+N+3 Blind/Buried staggered vias / Yes Yes 8 layer+
3+N+3 Blind/Buried stacked vias / / Yes 8 layer+

1+N+1 structure examples:

2+N+2 structure examples:

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Zhejiang, China

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